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The working principle of the vacuum generator is to use a nozzle to inject compressed air at a high speed.
Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate can effectively reduce electromagnetic emissions, crosstalk and improve the signal integrity of the product. An inferior stackup can increase emissions, crosstalk and also make the product more susceptible to outside noise. These issues can cause intermittent operation due to timing glitches and interference dramatically reducing the products performance and reliability.
As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. Our previous study showed that many alternative low silver solder paste materials had good printing and wetting performance as compared to SAC305 solder pastes. However, there is lack of information on the reliability of alternative alloy solder joints assembled using alternative low silver alloy solder pastes. In this paper, we will present the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling test (3000 cycles, 0°C to 100°C). Six different lead-free pastes were investigated. SAC305 solder joints were used as the control. Low and no silver solder pastes and a low temperature SnBiAg solder pastes were also included.
There are several levels of testing that can be performed in order to confirm the presence of any of the RoHS banned substances to confirm the make up of the alloy of the BGA solder spheres. The lowest level of testing involves the use of lead testing kits. These test kits use a simple swab on chemical in order to detect the presence of elemental lead. A chemical reagent, which changes color in the presence of lead
JOT TECHNOLOGY CO.,LIMITED sets out the anomaly that is the lack of intelligence available in ovens compared to elsewhere on the production line and the clear benefits of making the oven smarter. If you were handing prizes out for intelligence on the shop floor, I suspect the oven wouldn’t get the first prize, yet we have devoted so much time to factory intelligence and the path towards what many are calling the Smart Factory.
With consumers constantly looking for lower prices on their technology products and manufacturers trying to squeak out higher margins from their production lines, the need for process control and lower overhead costs have become even more important. One sector that is often overlooked is the hand soldering area of the factory. Many factories have been struggling with antiquated soldering systems for years. In some cases they are trying to make their investment in stations last much longer than they were designed for, or they are falsely trying to recoup their original investment ‐ all at the cost of higher operating expenses or even worse, reduced operator thru‐put.
JOY TECHNOLOGY CO.,LIMITED show how hybrid control and modeling tech- niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we obtain a robust system that can recover from faulty initial settings, adapt to environ- mental changes and unscheduled interrupts, and remove discrepancies associated with bidirectional printing machines.
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.
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